After having thoroughly analyzed on Samsung Galaxy S7, the Canadian Chipworks has subjected to the same treatment the edge version of the smartphone- announced in Barcelona last February 21 – through a thorough teardown.
Unlike other sites (iFixit) interested in evaluating the repair ability of the devices, Chipworks focuses on individual constituent components and their characteristics. The teardown focused specifically on camera, true workhorse of the new device in which a reduction in the number of pixels (from 16 to 12 megapixels than the Galaxy S6) is a performance enhancement. This is due to the transition from 1.12 µm size for each pixel of S6 to the current 1.4 µm. What is more, the rear sensor Chipworks believes the model IMX260 made by Sony.
Another aspect analysed was the PDAF technology, ovver the Dual Pixel Phase Detection, initially launched by Canon in 2013 with the DSLR EOS 70D and now adapted to mobile sensors by dedicating all the pixel array to the collection of data for the auto-focus system. What impressed the Chipworks team was the ability of engineers to use the technology within 1.4 µm pixels.
Other discoveries made within the body of the Galaxy S7 edge relate to the presence of the touch screen controller S6SMC41X, MSM8996 version of Snapdragon Qualcomm 820 and memory RAM LPDDR4 curiously built by outside vendor Hynix and not from the same Samsung.
Special: Chipworks underlines the presence of a solid bond between the RAM and the chipset, probably due to the intention to avoid problems with heat dissipation.
The team dedicated to teardown promised more details on other components of the Samsung Galaxy S7 edge over the next few days.